S5062X270RAU24(Coming Soon)
产品概述
- 2U (DC-MHS architecture)
- Dual Intel® Xeon® 6700 series processors, TDP up to 350W
- (32) DDR5 RDIMM, 8 channels per CPU(2DPC), up to 6400MT/s(1DPC) and 5200MT/s(2DPC)
- (8) Front hot-swap 2.5" U.2 PCIe 5.0 x4 NVMe drive bays
- (2) Rear hot-swap E1.S 9.5mm PCIe 5.0 x4 NVMe drive bays
- (2) 2280/22110 PCIe 5.0 x2 NVMe M.2 ports per node
- Up to (3) PCIe 5.0 expansion slots, supporting up to (2) 400W PCIe cards
- (1) PCIe 5.0 x16 OCP3 NIC Mezzanine slot (NCSI supported)
- (1) 1000Base-T Dedicated Server Management port per node with:
- ASPEED AST2600 with IPMI 2.0 & DMTF Redfish support
- Dual BIOS & BMC
- TPM2.0 and Hardware Root of Trust module are supported as optional
产品应用
- Cloud Computing Service
- Content Delivery Network
- Network Function Virtualization
- 5G Core and Edge Telecom Micro Data Center
- AI Inference and Machine Learning
图片和描述仅供参考，可能不完全准确。规格、功能和外观可能因型号和地区而异。产品供应状况和上市时间可能有所不同，请向当地供货商查询具体供货和详细规格。所有商标和标志均属于其各自的所有者。